Week 8

This week began testing of the boards. First test was the Visual Check. This involved physically checking the board for any defects, checking for any pins with no solder, any soldered joints that were dry or had a blob or looking for any bridging tracks.
Upon checking, all boards looked fine. There was a bridging track, but that was done purposely. There was also a slight blob, but I decided to leave it alone. It was very slight, I didn't think it would affect the board. Overall, the boards looked satisfactory, further testing will confirm this.
Next up was the continuity test. This involved checking for continuity of signals between each IC and its power or ground connection. In this case, IC's or power was not connected. Using a multimeter the connections to were the pins were going to connect were tested. Making sure that there was a connection and that it was the right one. All the results were recorded, the continuity was fine. Even though this was a simple test, it was long and tedious and took up the rest of the lab time that I had. The picture below is a partial of the recorded results. Next week will involve further testing of the board.


Partial picture of continuity test record.